• Contact us
  • Career
  • Terms and Conditions
  • Payment form
  • DE
  • EN
  • CN

Black cat logo Langer EMV-Technik

  • 关于我们
    • 公司
      • Career
      • Terms and Conditions
      • Company Profile
      • Milestones
    • 经销商
      • Asia
      • Europe
      • North America
    • Contact us
    • Map and Travel Information
    • Sponsoring
    • Events
    • Payment form
  • 产品
    • 印刷电路板的抗干扰性
      • 抗干扰开发系统
      • 用于开发过程的发生器
      • 配件(猝发 / 电快速瞬变脉冲发生器 IEC 61000-4-4)
      • 光信号传输
      • 猝发脉冲序列探测器
    • 印刷电路板的干扰发射
      • 用于开发过程的测试技术
      • 近场探头
      • 前置放大器
      • Near-Field Microprobes
      • 光信号传输
    • 集成电路测试技术
      • 集成电路的测试环境
      • 干扰发射
      • 集成电路的抗干扰性
    • IC Security
      • Fault Injection
      • Positioning systems
    • 扫描仪
      • Langer 扫描仪
      • Accessories for Langer Scanner
      • Near-field Scanner Probes
    • 软件
      • CS-Scanner, ChipScan-Scanner 软件
      • CS-ESA set, ESA芯片扫描软件
    • 测试及校准工作台
      • 印刷电路板
      • 集成电路
      • 连接器
    • 测试技术的学习和培训
      • EMC-Basic 1 set
      • EMC-Basic 2 set
      • DB 20 set
      • D10 set
  • 研讨班
    • SF-GE, SF-GE
    • SF-G, SF-Basics
    • SA-GE, SA-GE
    • SA-G, SA-Basics
    • SF IHS
    • SA IHS
    • Dates Overview
  • 服务
    • 电磁兼容性讲座
      • WS ESA1
      • WS IC
      • WS PCB
      • WS Scanner
      • 集成电路的电磁兼容性干扰发射分析
      • 集成电路的电磁兼容性抗干扰分析
      • SMM Langer
      • COCI
    • EMV-B, 咨询 / 电子干扰排除
  • 电磁兼容性知识
    • 专业文献:Board-EMC
      • 集成电路的电磁兼容性抗干扰分析
      • 集成电路的电磁兼容性干扰发射分析
    • 专业文献: IC-EMC
      • 集成电路的电磁兼容性抗干扰分析
      • 集成电路的电磁兼容性干扰发射分析
    • Langer EMV-Technik in scientific research
    • 资讯
      • 17 ESA1 set
      • 16 ICI-DP sets
      • 15 tent and GP 23 set
      • 14 Mini Burst Field Generators in pocket size
      • 13 Achieve interference immunity by identifying and eliminating EMC weak points:
      • 12 ICR: Near-field analysis in the micrometer range and its advantages
      • 11 ChipSan-ESA now supports more measuring devices
      • 10 P512 and DPI
      • 09Surface Scan on IC Level with high Resolution
      • 08 ESD and Efficient Electronic Design
      • 07 EMC Measurement Technology for Testing Integrated Circuits - An Introduction
      • 06 Measuring the Shielding Effectiveness at IC Level with the IC Test System P1402/P1502
      • 05 Time and cost savings when recording and documenting RF measurements with a spectrum analyzer
      • 04 Radiated Emissions at the PCB Level - An Introduction
      • 03 消除脉宽调制 (PWM) 直流电机的电磁骚扰
      • 使用朗格尔(Langer EMV-Technik GmbH)近场探头实现至6 GHz的测量
      • 01 EMC实用技巧和建议 如何使用近场探头抑制LVDS连接的干扰
    • 视频
      • 产品用途
      • 研讨会
  • 印刷电路板的抗干扰性
  • 印刷电路板的干扰发射
    • 用于开发过程的测试技术
    • 近场探头
      • 无源LF(100 kHz - 50 MHz)
      • 无源RF(30 MHz - 3 GHz)
        • RF Basic set
        • RF1 set近场探头组(30MHz-3GHz)
        • RF2 set近场探头组(30MHz-3GHz)
        • RF3 mini set
        • RF4-E set
        • RF-R 400-1磁场探头(30MHz-3GHz)
        • RF-R 50-1磁场探头(30MHz-3GHz)
        • RF-R 3-2磁场探头(30MHz-3GHz)
        • RF-R 0.3-3迷你型磁场探头(30MHz-3GHz)
        • RF-B 50-1
        • RF-B 3-2磁场探头(30MHz-3GHz)
        • RF-B 0.3-3迷你型磁场探头(30MHz-3GHz)
        • RF-U 5-2磁场探头(30MHz-3GHz)
        • RF-U 2.5-2磁场探头(30MHz-3GHz)
        • RF-K 7-4磁场探头(30MHz-3GHz)
        • RF-E 02电场探头(30MHz-3GHz)
        • RF-E 03电场探头(1GHz-3GHz)
        • RF-E 04电场探头(30MHz-3GHz)
        • RF-E 05电场探头(30MHz-3GHz)
        • RF-E 09电场探头(30MHz-3GHz)
        • RF-E 10电场探头(30MHz-3GHz)
      • 无源XF(30 MHz - 6 GHz)
      • 无源SX(1 GHz - 20 GHz)
      • HR, Passive, up to 40 GHz
      • 有源MFA(1 MHz - 6 GHz)
      • CM-SHP
      • Individual Characterization
    • 前置放大器
    • Near-Field Microprobes
    • 光信号传输
  • 集成电路测试技术
  • IC Security
  • 扫描仪
  • 软件
  • 测试及校准工作台
  • 测试技术的学习和培训
  • 产品
  • 印刷电路板的干扰发射
  • 近场探头
  • 无源RF(30 MHz - 3 GHz)
  • RF-E 02, 电场探头(30MHz-3GHz)

RF-E 02

电场探头(30MHz-3GHz)

  • Short description
  • Recommended products
  • Technical parameters
Send enquiry Datasheet
  • RF-E 02, 电场探头(30MHz-3GHz)
  • Probe head
    Probe head
RF-E 02, 电场探头(30MHz-3GHz) Probe head
  • RF-E 02, 电场探头(30MHz-3GHz)
  • Probe head
Short description

RF-E 02型近场探头用于测量总线结构、较大的元器件或者供电表面产生的耦合电场。探头下方的电极面积大约是2 cm x 5 cm。该探头用于在距离模块1cm到2 cm的位置检测。

The RF-E 02 is a passive near-field probe. In principle it has the same structure as the RF-E 05 and RF-E 10 probes. When measuring, the bottom surface of the probe head is positioned close to the measured object. This allows the E-field emitted by an assembly to be detected. To achieve a higher resolution, only the tip of the probe head should be held toward the measured object. The near-field probe is small and handy. It has a current attenuating sheath and, therefore, is electrically shielded. It can be connected to a spectrum analyzer or an oscilloscope with a 50 Ω input. The H-field probe does not have an internal terminating resistance of 50 Ω.

Technical parameters
频率范围 30 MHz - 1.5 GHz
探头尺寸 ≈ (23 x 53) mm
输出接口 SMB, male, jack
频率特性 [dBµV] / [dBµV/mm] 频率特性 [dBµV] / [dBµV/mm] 频率特性 [dBµV] / [dBµV/mm]
电场校正曲线 [dBµV/mm] / [dBµV] 电场校正曲线 [dBµV/mm] / [dBµV] 电场校正曲线 [dBµV/mm] / [dBµV]
  • © Langer EMV-Technik
  • Contact us
  • Legal notice
  • Privacy policy
  • Sponsoring
  • facebook
  • YouTube
  • Linked-In
  • Twitter
Europäischer Fonds für regionale Entwicklung EFRE - Europäischer Sozialfonds ESF